Arizona Tribune - High-Performance Computing Hardware Market to Grow at 13.6% CAGR to 2035, Predicts IDTechEx

HPC systems, including supercomputers, outclass all other classes of computing in terms of calculation speed by parallelizing processing over many processors. HPC has long been an integral tool across critical industries, from facilitating engineering modeling to predicting the weather. The AI boom has intensified development in the sector, growing the capabilities of hardware technologies, including accelerators, interconnects, and memory, at astounding rates.

The new report from market intelligence firm IDTechEx, "Hardware for HPC and AI 2025-2035: Technologies, Markets, Forecasts", predicts that the growing use-cases of AI and machine learning and scale of the largest AI models will drive significant growth in this already-large market. This results in an HPC hardware market forecast of US$581B by 2035, growing at a CAGR of 13.5% from this year.

The world's largest exascale HPC systems are run by government-operated national labs, but private corporations, including cloud providers like Microsoft Azure, are not far behind. Growth is set to accelerate with the expanding deployment of AI.

Sam Dale, Senior Technology Analyst and co-author of the report, advises: "Key hardware challenges in HPC revolve around processors, memory and storage, advanced packaging, interconnects, and thermal management. GPUs and other AI accelerators grab all the headlines in the processor space; however, substantial progress has also taken place in the CPU market, with core counts approaching 200 in chips like AMD's Turin processors and the deployment of integrated heterogeneous systems - GPUs and CPUs integrated into the same package - taking place in the world's most powerful supercomputers, including the USA's El Capitan and China's Tianhe-3."

In the memory space, the adoption of HBM (High Bandwidth Memory) has been crucial to the growing capabilities of accelerators, with approximately 95% of accelerators in HPC now employing the technology, but research into next-generation memory technologies is being driven by the high energy consumption of today's memory choices.

Advanced packaging is a key enabler of all these chip technologies, with the 3D stacking of memory on top of logic being the best approach to achieve ultra-high bandwidths by shrinking on-device interconnect distances.

IDTechEx's new report, "Hardware for HPC and AI 2025-2035: Technologies, Markets, Forecasts," is essential for understanding the HPC market, including trends, challenges like storage development, and geopolitical impacts. At the dawn of the exascale era and the most fruitful period for AI development so far, supercomputing demand is set to surge. The report provides 10-year forecasts for the overall HPC hardware market and key technologies, along with profiles of over 50 industry players. Readers gain a comprehensive view of the present and future of this dynamic industry.

To find out more about the new IDTechEx report, including downloadable sample pages, see www.IDTechEx.com/HPC.

About IDTechEx

IDTechEx provides trusted independent research on emerging technologies and their markets. For more information, contact [email protected] or visit www.IDTechEx.com.

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SOURCE: IDTechEx

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